Compact laser head
A small head mounts directly on the motion system, close to the optics, so the machine stays compact.
Applications Glass processing
TGV and glass processing
Through-glass vias for advanced packaging, with no microcracks. The femtosecond laser modifies the glass, selective etching opens the via, and the throughput scales with the number of lasers on the line.
[value] µm
Smallest via diameter in 0.5 mm borosilicate glass.
1 : [value]
Aspect ratio after selective etching.
[value] vias/s
Modification rate per laser head.
From problem to process
Glass is the next substrate. Drilling it is the hard part.
01 · Problem
Millions of vias, zero cracks
Glass interposers and substrates need dense via arrays. Mechanical drilling, CO2 and nanosecond lasers leave microcracks, heat-affected zones and taper that fail in reliability testing.
02 · Requirement
What the process needs
- Crack-free walls with no heat-affected zone
- High aspect ratio and controlled taper
- Micron-level position accuracy across the panel
- Throughput that holds 24/7 on a production line
03 · Process
Modify, then etch
Femtosecond pulses are absorbed only at the focus, inside the glass. They change the material along the via path without cracking it. A wet etch then removes the modified glass far faster than the bulk, opening a clean via.
Why the architecture fits
Passive air cooling
No chiller and no water lines in the cleanroom. Fewer utilities to plan, fewer parts to service.
Simple integration
CAN and USB control, TTL pulse-picker triggering and an analog power input connect to the machine controller.
Scales to multi-head
Run several lasers side by side over one panel. Throughput grows with each head, not with a bigger laser.
Evidence
Results from the application lab
Microscope images from LITILIT test runs. Every sample lists its material, thickness and magnification.
[Microscope image: via array, top view]
[Microscope image: via cross-section]
From demo laser to production line
[Customer] tested one INDYLIT 20 on glass interposer samples, then moved to [number] lasers on their production line. Here is how the process window and the order grew.
Read the case studyTypical process window
Starting parameters from our lab. Your material, thickness and design will move them, so we confirm every number on your own samples.
- Materials
- Borosilicate, fused silica, [others]
- Glass thickness
- [value] – [value] mm
- Via diameter
- [value] – [value] µm
- Taper
- [value]°
- Recommended wavelength
- 1030 nm (IR)
- Recommended laser
- INDYLIT 20
Lasers for this application
The laser we recommend for this process.
INDYLIT 20
Up to 20 W at 1 MHz, with an optional 515 nm green module, for high-rate processing of glass panels.
380 fs pulses
1030 / 515 nm
Passively air cooled
View INDYLIT 20
Other applications
Send us your glass. We'll send back vias.
Ship samples to our Vilnius application lab. We process them to your via design and return the parts with microscope images and the parameters we used.
Discuss your application with an engineer.
Tell us the material and the result you need. A laser engineer replies within [response time].
Buying for production?
Ask about lead times, volume pricing, supply capacity and long-term availability.
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