Compact laser head
Integrates into wafer processing tools where space is limited.
Applications Semiconductor
Semiconductor
Dicing, grooving and drilling of thin wafers and brittle materials with minimal chipping and debris. We are building process data with partners and would like to test your application.
[Photo: thin wafer after laser dicing]
[value] µm
Kerf width on [value] µm silicon.
[value] µm
Edge chipping after dicing.
[value] mm/s
Grooving speed on [material].
From problem to process
Thinner wafers, smaller dies. Less room for damage.
01 · Problem
Blades chip, heat damages
As wafers get thinner and dies smaller, blade dicing causes chipping and cracks. Longer-pulse lasers leave heat damage and debris that lower die strength and yield.
02 · Requirement
What the process needs
- Narrow kerf with minimal chipping
- No heat damage to nearby structures
- Clean processing with little debris
- Throughput that fits fab cycle times
03 · Process
Remove material without heat
Femtosecond pulses ablate thin layers of silicon, low-k films and other materials before heat spreads, giving narrow, clean cuts and grooves on fragile wafers.
Why the architecture fits
Passive air cooling
No water lines near the wafer and fewer utilities in the fab.
Scales to multi-head
Add lasers to raise throughput without changing the process.
Simple integration
Standard interfaces for tool controllers and automation.
Evidence
Results from the application lab
Microscope images from LITILIT test runs. Every sample lists its material, thickness and magnification.
[Microscope image: diced wafer edge]
[Microscope image: groove cross-section]
Partner project: [process]
We are running a joint process study with [partner] on [material]. Results will be published here once they are confirmed.
Read the case studyTypical process window
Starting parameters from our lab. Your material, thickness and design will move them, so we confirm every number on your own samples.
- Materials
- Silicon, SiC, sapphire, low-k films, [others]
- Wafer thickness
- [value] – [value] µm
- Kerf width
- [value] µm
- Chipping
- < [value] µm
- Recommended wavelength
- 515 nm (Green, optional) or 1030 nm (IR)
- Recommended laser
- INDYLIT 20
Lasers for this application
The laser we recommend for this process.
INDYLIT 20
Up to 20 W at 1 MHz, with an optional 515 nm green module, for wafer processing.
380 fs pulses
1030 / 515 nm
Passively air cooled
View INDYLIT 20
Other applications
Test your wafers with us.
Send samples to our Vilnius application lab. We process them, share the results and parameters, and plan the next step with your team.
Discuss your application with an engineer.
Tell us the material and the result you need. A laser engineer replies within [response time].
Buying for production?
Ask about lead times, volume pricing, supply capacity and long-term availability.
Request a quote